Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices

Lu Fang; Lyle Alexander Menk

doi:doi:10.11648/j.am.20190804.17

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Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices

Lu Fang, Lyle Alexander Menk

Published in Advances in Materials (Volume 8, Issue 4)

Received: 12 November 2019 Accepted: 5 December 2019 Published: 13 December 2019

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Abstract

Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.

Published in	Advances in Materials (Volume 8, Issue 4)
DOI	10.11648/j.am.20190804.17
Page(s)	176-182
Creative Commons	This is an Open Access article, distributed under the terms of the Creative Commons Attribution 4.0 International License (http://creativecommons.org/licenses/by/4.0/), which permits unrestricted use, distribution and reproduction in any medium or format, provided the original work is properly cited.
Copyright	Copyright © The Author(s), 2019. Published by Science Publishing Group

Keywords

Gas Leak, Ingress, Egress, Hermetic Package, MEMS, MCM, Reliability

References

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[2]	G. M. Rebiez and J. B. Muldavin, "RF MEMS Switches and Switch Circuits," IEEE Microwave Magazine, no. December, pp. 59-71, 2001.
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[5]	M. Lutz, A. Partridge, P. Gupta, N. Buchan, E. Klaassen, J. McDonald and K. Petersen, "MEMS OSCILLATORS FOR HIGH VOLUME COMMERCIAL APPLICATIONS," in TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference, Lyon, France, 2007.
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APA Style

Lu Fang, Lyle Alexander Menk. (2019). Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Advances in Materials, 8(4), 176-182. https://doi.org/10.11648/j.am.20190804.17

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ACS Style

Lu Fang; Lyle Alexander Menk. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Adv. Mater. 2019, 8(4), 176-182. doi: 10.11648/j.am.20190804.17

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AMA Style

Lu Fang, Lyle Alexander Menk. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Adv Mater. 2019;8(4):176-182. doi: 10.11648/j.am.20190804.17

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@article{10.11648/j.am.20190804.17,
  author = {Lu Fang and Lyle Alexander Menk},
  title = {Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices},
  journal = {Advances in Materials},
  volume = {8},
  number = {4},
  pages = {176-182},
  doi = {10.11648/j.am.20190804.17},
  url = {https://doi.org/10.11648/j.am.20190804.17},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20190804.17},
  abstract = {Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.},
 year = {2019}
}

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TY  - JOUR
T1  - Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices
AU  - Lu Fang
AU  - Lyle Alexander Menk
Y1  - 2019/12/13
PY  - 2019
N1  - https://doi.org/10.11648/j.am.20190804.17
DO  - 10.11648/j.am.20190804.17
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 176
EP  - 182
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20190804.17
AB  - Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.
VL  - 8
IS  - 4
ER  -

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Author Information

Lu Fang

Department of Microsystems Integration, Sandia National Laboratories, Albuquerque, USA
Lyle Alexander Menk

Department of Microsystems Integration, Sandia National Laboratories, Albuquerque, USA

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Plain Text BibTeX RIS

APA Style

Lu Fang, Lyle Alexander Menk. (2019). Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Advances in Materials, 8(4), 176-182. https://doi.org/10.11648/j.am.20190804.17

Copy | Download

ACS Style

Lu Fang; Lyle Alexander Menk. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Adv. Mater. 2019, 8(4), 176-182. doi: 10.11648/j.am.20190804.17

Copy | Download

AMA Style

Lu Fang, Lyle Alexander Menk. Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices. Adv Mater. 2019;8(4):176-182. doi: 10.11648/j.am.20190804.17

Copy | Download

@article{10.11648/j.am.20190804.17,
  author = {Lu Fang and Lyle Alexander Menk},
  title = {Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices},
  journal = {Advances in Materials},
  volume = {8},
  number = {4},
  pages = {176-182},
  doi = {10.11648/j.am.20190804.17},
  url = {https://doi.org/10.11648/j.am.20190804.17},
  eprint = {https://article.sciencepublishinggroup.com/pdf/10.11648.j.am.20190804.17},
  abstract = {Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.},
 year = {2019}
}

Copy | Download

TY  - JOUR
T1  - Gas Ingress and Egress of MEMS Multi-Chip Modules and MEMS Devices
AU  - Lu Fang
AU  - Lyle Alexander Menk
Y1  - 2019/12/13
PY  - 2019
N1  - https://doi.org/10.11648/j.am.20190804.17
DO  - 10.11648/j.am.20190804.17
T2  - Advances in Materials
JF  - Advances in Materials
JO  - Advances in Materials
SP  - 176
EP  - 182
PB  - Science Publishing Group
SN  - 2327-252X
UR  - https://doi.org/10.11648/j.am.20190804.17
AB  - Hermetic microcircuit packaging was the dominant method of protecting semiconductor devices in the 1960s and 1970s. After losing majority market sectors to plastic encapsulated microelectronics over the last a few decades, hermetic packaging remains the preferred method of protecting semiconductor devices for critical applications such as in military, space, and medical fields, where components and systems are required to serve for several decades. MEMS devices impose additional challenges to packaging by requiring specific internal cavity pressures to function properly or deliver the needed quality (Q) factors. In MEMS multichip modules, internal pressure requirement conflicts arise when different MEMS devices require different internal gases and pressures. The authors developed a closed-formed equation to model pressure changes of hermetic enclosures due to gas ingression. This article expands the authors mathematical model to calculate gas pressure of a MEMS multichip module package as well as those of MEMS devices inside the multichip module package. These equations are not only capable of calculating service lifetimes of MEMS devices and multi-chip modules but can also help develop MEMS device packaging strategies to extend the service life of MEMS multi-chip modules.
VL  - 8
IS  - 4
ER  -

Copy | Download